sales@plasmaetch.com
MK-III | Dual Chambers Plasma System
High Production Plasma System
MK-III is our MK-II times two.. but not twice the footprint. If you need serious production throughput, this system is for you with its dual chambers with 24 levels in each, you can run both chambers simultaneously or by themselves. Built as an extension of our MK-II platform, the MK-III is the choice of discerning engineers.
Domestic Price: Please Contact For Pricing
Call us at 775-883-1336 or email us at sales@plasmaetch.com for more information.
Overview
The generous aluminum chambers accommodates a properly sized active processing surface with our standard configurations having dual bays as few as 6 or as many as 24 plasma processing levels, each 24” by 18.”
Our oxygen service vacuum pump and booster is equipped with a two point purge system to minimize any corrosive end products forming in the pump thereby extending the service life while lowering maintenance costs
Features
The two Huge all aluminum chambers accommodate a generously sized active processing surface with its standard configurations of 24 plasma processing levels in each of the dual chambers. Each level, a generous 24” by 18” of usable plasma cleaning area.
Processing your boards, whether they be small or large, PTFE, Polyamide or Rigid-Flex you will find that all are uniformly etched by the MK-II, ready for your next production step.
Specifications
Standard System Features
6, 8, 12, 16 and 24 Horizontal “Shelf” Systems available
Each shelf is 24” x 18” on 1.5” Spacing
R.F. Generator & Automatic Matching Network 1250 to 5000 Watts @ 13.56MHz
Electrostatic Shielding of chamber to promote uniformity
Process Temperature Control 1250 F to 3000 F to eliminate a warm up cycle
Two Mass Flow Controllers, 0-2000 SCCM
Low gas supply pressure alarms on process and purge gas
MKS 0-10 Torr Capacitance Vacuum Gauge
Microprocessor Control System w/ Touch Screen interface
Multiple (up to 3 stage) Recipe Storage
Edwards Oxygen Service Vacuum Pump
Edwards Roots style Booster Blower
3 Micron Vacuum Pump Oil Filtration
Two point Automatic N2 Purging of the Vacuum Pump
Oil Mist Coalescing Filter on the Vacuum pump’s exhaust
Optional System Features
Windows Computer Control System w/ Touch Screen Interface
Data Recording, Reporting w/Event Viewing and printing
Signal Light Tower
Edwards GV80 Dry Vacuum Pump
MKS Automatic Throttle Vacuum Controller
Up to 4 Mass Flow Controllers
Process controlled Gas steering matrix; 5 gas inputs through 2 or 3 MFC’s
Controlled Rate N2 Chamber Purging
Custom Chamber sizes and configurations
Custom Electrode sizes and configurations
Facility Optional
Closed Loop Chiller for RF generator cooling
Packed Bed Fume Scrubber for vacuum pump exhaust
Heatless Compressed Air Dryer (Vacuum pump Purge Gas Generator)
System Specifications
Footprint, Plasma Console 120 “ X 79” X 45”
Footprint, Vacuum Pump 16 “ X 30” X 17”
Weigh varies with configuration
Facility Requirements
AC Service; 120/208 VAC, 50/60 Hz, 3 Phase 5 Wire 50-100 Amps
Compressed Air Service 80-100 PSI <0.5 CFM
Conditioned Environment less than 850 F non-condensing
Regulated Process Gases 15 to 30 PSI
Cooling Water Source for RF generator @ 2GPM
Multi-Layer Circuit Boards Case Study
Parts: Multi-Layer Circuit Boards
Contaminates: Hydrocarbons
Industry: Multi-Layer Circuit Board
Details of application:
This leading manufacturer of printed circuit boards uses plasma to form .003 mil micro via holes in their circuit boards. The plasma used is a directional, Reactive Ion Etch (RIE). The company uses a print and etch process to open the copper, then the Reactive Ion Etch forms the micro via.
Plasma Etch is the first plasma manufacturer to develop multiple level RIE and use plasma for micro via formation. This project was done in cooperation with Hadco Phoenix. Plasma Etch offers eight and sixteen level RIE systems.
Reactive Ion Microvia formation is very cost competitive to laser drilling.
