Plasma Treatment System | MK-II
Industrial Plasma Etcher

MK-II | Plasma Treatment System

The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24” by 18.”

Our oxygen service vacuum pump and booster is equipped with a two point purge system to minimize any corrosive end products forming in the pump thereby extending the service life while lowering maintenance costs.

 

MK-II | Plasma Treatment System

Processing your boards, whether they be small or large, PTFE, Polyamide or Rigid-Flex you will find that all are uniformly etched by the MK-II, ready for your next production step.

As plasma is inherently a green process it also reduces production expense by eliminating unwelcome and often expensive chemical waste associated with chemical etching and cleaning. Our simple to use, intuitive touch screen interface has control over every aspect of the plasma process ensuring reliability and repeatability.

The MK-III is capable of drilling three millimeter microvias utilizing a resin coated copper foil technology in PCB multi-layers. It can etch a one millimeter polyimide windows on High Density Drive suspensions (HDD). The MK-III is designed for aggressive drilling of HDD suspensions & microvias with no undercut.

.

MK-II | Plasma Treatment System

Standard System Features
6, 8, 12, 16 and 24 Horizontal “Shelf” Systems available
Each shelf is 24” x 18” on 1.5” Spacing
R.F. Generator & Automatic Matching Network 1250 to 5000 Watts @ 13.56MHz
Electrostatic Shielding of chamber to promote uniformity
Process Temperature Control 1250 F to 3000 F to eliminate a warm up cycle
Two Mass Flow Controllers, 0-2000 SCCM
Low gas supply pressure alarms on process and purge gas
MKS 0-10 Torr Capacitance Vacuum Gauge
Microprocessor Control System w/ Touch Screen interface
Multiple (up to 3 stage) Recipe Storage
Edwards Oxygen Service Vacuum Pump
Edwards Roots style Booster Blower
3 Micron Vacuum Pump Oil Filtration
Two point Automatic N2 Purging of the Vacuum Pump
Oil Mist Coalescing Filter on the Vacuum pump’s exhaust

Optional System Features
Windows Computer Control System w/ Touch Screen Interface
Data Recording, Reporting w/Event Viewing and printing
Signal Light Tower
Edwards GV80 Dry Vacuum Pump
MKS Automatic Throttle Vacuum Controller
Up to 4 Mass Flow Controllers
Process controlled Gas steering matrix; 5 gas inputs through 2 or 3 MFC’s
Controlled Rate N2 Chamber Purging
Custom Chamber sizes and configurations
Custom Electrode sizes and configurations

Facility Optional
Closed Loop Chiller for RF generator cooling
Packed Bed Fume Scrubber for vacuum pump exhaust
Heatless Compressed Air Dryer (Vacuum pump Purge Gas Generator)

System Specifications
Footprint, Plasma Console 66 “ X 79” X 26”
Footprint, Vacuum Pump 16 “ X 30” X 17”
Weigh varies with configuration

Facility Requirements
AC Service; 120/208 VAC, 50/60 Hz, 3 Phase 5 Wire 50-100 Amps
Compressed Air Service 80-100 PSI <0.5 CFM
Conditioned Environment less than 850 F non-condensing
Regulated Process Gases 15 to 30 PSI
Cooling Water Source for RF generator @ 2GPM

Plasma Etch MK-II | Printed Circuit Boards Case Study

Parts: Printed Circuit Boards
Contaminates: Bromine Based Epoxy Smeared On Inner Layer Copper Interconnects
Industry: Printed Circuit Board

Details of application:

This company is a defense contractor to the U.S. Government. They need to remove the drill smear from the through hole interconnects in the printed circuit board. The military requires a three point connection on the inner layer interconnects. This plasma process is etchback. This process produces a 5 to 6 tenth of a mil removal of epoxy in the through hole. The through hole interconnects must be free of epoxy smear to allow good electrical contact between the inner layer and surface copper.

This company uses a combination of Carbon Tetrafluoro-Methane and Oxygen plasma to etchback the throughholes in their printed circuit boards.

This company chose Plasma Etch based on several advantages our company offers. Process temperature control is the single most important parameter in the plasma process. Temperature has primary control over etch rate and a secondary effect on etch uniformity and repeatability, the process temperature must be regulated throughout the entire plasma sequence. Our process temperature is regulated by the patented electrode temperature control system. No other plasma offers non-plasma generated chamber heating.

The plasma process generates high energy plasma fields at the edge of the electrodes, which causes accelerated etching at these edges. The overall effect is higher etch rates at the electrode edges; with a gradual reduction in the etch rate as it approaches the center of the electrode. This can be viewed as the bull's eye effect that results in severe process non-uniformity. All vacuum chamber internal surfaces on Plasma Etch's systems are electro statically shielded to eliminate plasma reactions with the chamber walls. Plasma activity is then uniform across the electrode surface. This creates a uniform etch across the entire surface.

Plasma Etch utilizes high frequency RF power (13.57 MHz) to maximize processing rates and production throughput. The physics of a high frequency RF plasma is very different from a low frequency RF plasma. The high frequency generates a much more reactive plasma. The high frequency plasma is isotropic (etch uniformly in all directions). This feature is required for processing three dimensional objects or small drilled holes. Additionally, systems that operate at 13.57 MHz are three times as fast as systems that operate at 40 KHz.

MK-II | Plasma Treatment System

The following information will help you to understand the facts and features that have established Plasma Etch equipment as the leader in high-capacity plasma systems. We don't just meet industry standards, we set them.

As with any piece of machinery, there are many different parts and functions that make a world of difference in the performance.At Plasma Etch, we take great pride in ensuring that the control of the plasma process is in the hands of the system operator.

Plasma Etch, Inc. has invested extensive research and development time over the last 30 years to establish cutting-edge technology for our plasma equipment. We are able to offer features that are unique to the Plasma Etch, Inc., product line, including patented features which we invented, developed and now manufacture exclusively.

What does Plasma Etch, Inc., offer in Temperature Control?

Process Temperature is the most important parameter in the plasma process. Precise control by the operator is extremely important. Plasma Etch, Inc. manufactures equipment featuring a patented design which directly regulates the temperature of the electrode. This technique is proven and highly reliable and gives the operator absolute control. A consistent temperature is maintained throughout the entire plasma sequence and is controlled completely independent of the plasma process. Any temperature within the systems' control range can be selected and is then automatically maintained. We invented a way not only to regulate heating and cooling of the process but also a way to produce both heating and cooling ability. This PATENTED feature is unique to the Plasma Etch, Inc., product line. Through this design, the plasma system is able to function at the highest allowable temperature for any given material or substrate and you can repeat the process as many times as you choose with predictable results each time. Temperature control provides you processing at the fastest possible rate while maintaining a consistent temperature over the entire surface of the substrate. Our systems provide you, the operator have total control of the temperature through a completely independent, computer-operated source, not reliant upon other factors or parameters of the plasma sequence. You are never required to "warm up" or "pre-run" our plasma systems and there is no throughput limiting "intermittent service" or stabilization cycles. There is no ramping of temperature at any time during the cycle - temperatures are consistent. Our plasma systems self-regulate temperatures by maintaining the electrodes at the precise temperatures you have chosen for the plasma sequence.

What does Plasma Etch, Inc. offer in Vacuum Chamber Design?

Through extensive research and a close working relationship to many different industries, we have invented, developed and now manufacture vacuum chambers with patented features and industry-proven design. At Plasma Etch, Inc. we manufacture our vacuum chambers out of high-durability, aerospace-grade aluminum of the highest quality. We discovered that aluminum is the primary material for plasma processing and continued to fine tune each and every plasma sequence until total uniformity was achieved across a vast array of materials. That is, we found a solution that worked for many different industries using plasma for many different substrates and materials. Plasma Etch, equipment features PATENTED Electrostatic Shielding which helps generate a high energy, uniform plasma across the electrode surface. Plasma Etch, Inc. was the first to realize this and this patented feature is unique to the Plasma Etch, Inc., product line. As a result of our dedication and hard work, we developed this technique and were awarded through the United States Patent Office the exclusive right to produce this feature. Plasma processing does have the ability to cause severe damage to any substrate if the proper controls are not in place. Lack of uniformity results in burnt, warped and modified substrates or materials and our solution met those challenges with proven design.

What does Plasma Etch, Inc. offer in System Software?

The operating interface for every Plasma Etch, Inc., plasma system comes with our own custom software, specifically designed for our systems. Easy to use, program that oversees the operation of every plasma system. The operator is trained in the use of the software by one of our friendly engineers on a person to person basis.

On the computer control models, high-quality Dell® computers oversee optimum plasma processing parameters which are programmed, controlled and monitored by the computer. Out of limit conditions are alarmed and permanently recorded, product data, process parameter set points, monitored process parameters, alarm conditions and process sequence status are displayed on the graphic monitor for ready reference. All product and process data is automatically archived to the hard disk. A major advantage of computer control is the ability to store and retrieve a large library of part numbers and their appropriate processing parameters. Correct processing parameters are under computer control and are not dependent on individual operator judgment. "Triple Sequence Program" features provide the capability for running three independent and different plasma processes sequentially, one process directly after the next.

What does Plasma Etch, Inc., offer in Etch Rates?

Average etch rates of our systems met an amazing 3X faster than competing, comparable plasma systems in tests done by our customers. How do we do it? We have built plasma equipment for over 30 years, we've been involved in many experimental collaborations using plasma. We have tried and tested all aspects of the plasma process and through close observation, high R.F. power and PATENTED Plasma Process Temperature Control and PATENTED Electrostatic Shielding among other design factors ensure excellent quality at the highest etch rates. If you have questions or would like to know what potential etch rates you could achieve, we offer FREE Sample Processing so you can evaluate features such as etch rates and process uniformity.

What does Plasma Etch, Inc., offer in Electrode Design?

We manufacture many different types of plasma etching equipment. From Tumbler Etchers to square chamber, Batch-type to major Reel to Reel plasma systems, we have built many different electrodes over the years and many custom designs. Our standard plasma systems contain the horizontal planar electrodes that provide shelving on which to lay the substrate. This was the easiest loading and unloading for the operator. Some misunderstandings about this style of electrode were called into question and Plasma Etch, Inc., evaluated the facts and stood by this design as it proved to be the best. Our electrodes do not inhibit the dispersal of gases or compromise etchback performance in any way. Our power and ground electrodes etch at the same rate and substrates do not require any flipping or moving to achieve maximum etch uniformity. All that is basically required of the system operator is placing the substrate on the electrode, close the system door and start the process. It really is that easy.

What does Plasma Etch, Inc., offer in R.F. Power? R.F.

power is a critical parameter in the plasma process since R.F. frequency and power level directly affect processing rates. Plasma Etch, Inc. manufactures plasma systems with high-frequency, high R.F. power (13.56 MHz) that supplies consistent power throughout the entire plasma sequence, providing maximum and predictable etch rates and is totally independent of all other plasma parameters. High frequency R.F. power generates highly reactive plasma, an isotropic plasma and high speed etch rates. Isotropic plasma etches in all directions and is most functional for three dimensional substrates.

What does Plasma Etch, Inc., offer in Component Parts?

When you make a large purchase with so many smaller parts, it's nice to know exactly what you're getting. If something goes wrong, can you replace it and if so, how? At Plasma Etch, Inc., we manufacture our systems with off-the shelf, commercially available components and sub-assemblies. This helps ensure that your system is always easily repaired and reliable. We have always been above the standard by using high-quality components and sub-assemblies.

What does Plasma Etch, Inc., offer in Plasma Cleanliness?

Our plasma equipment does not require any cleaning or rebuilding of vacuum pumps nor do our plasma systems contaminate the substrate during general processes. Our systems produce the etchback/desmear process as the only reaction taking place. No board or chamber contamination occurs. We have studied and designed our systems to provide excellent, clean service for which the systems are manufactured. Plasma Etch, Inc., has always offered plasma systems that require no or low maintenance with extremely high reliability. Our plasma systems require no additional secondary plasma sequences to remove deposited residues from the plasma process which dramatically damages production throughput.

What does Plasma Etch, Inc., offer in Gas Distribution?

The gas distribution of a Plasma Etch, Inc. system can vary according to the specific systems' applications and the customer’s requirements. Generally, our systems house multiple gas porting delivery designs. This technique has been proven to be the most effective and reliable providing excellent results. We can provide unique solutions for any application needing exceptional gas distributions.

On the computer control systems: the "2 Channel X 2 Gas" or "2 Channel X 5 Channel" feature allows the customer to connect either "2" or "5" different plasma gas sources to the system. Any contamination of any two of these gases may be used in the plasma process. The mass flow controllers are automatically recalibrated for each selected gas.

What does Plasma Etch, Inc., offer in Nitrogen Purging?

Our plasma systems using CF4 gas as a process gas feature nitrogen purging that is automatic and functional any time the vacuum pump is operational. Our purging function is transparent to the operator and has no impact on normal processing.

What does Plasma Etch, Inc., offer in System Reliability?

At Plasma Etch, Inc., we incorporate system designs that maximize system reliability and minimize cost of ownership. How? We use high quality, industry proven components and sub-assemblies throughout our plasma equipment. This is the Plasma Etch, Inc., philosophy, to manufacture a highly reliable system and offer it to industry at a competitive price. A balance of our custom designs, knowledge of plasma, quality materials, excellent workmanship and attention to detail has resulted in the Plasma Etch, world-class reputation for reliability and superior results.

What does Plasma Etch, Inc., offer in Intermittent Service?

Plasma Etch, Inc., equipment maintains it's temperatures at a constant from start to finish with intermittent service. There is zero delay in restarting the plasma process from a standby condition. No time-wasting system temperature re-stablization is required, as with some competitive plasma equipment.