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PE-2000R | Reel to Reel Plasma Etcher
Roll to Roll Plasma Etching System

Reel to Reel | Roll to Roll Plasma Etcher

The PE-2000R Roll to Roll plasma system is specially fitted with a continuous feed drive and take up system to accommodate continuous flexible substrates and roll/reel mounted materials. Our Reel-to-Reel plasma system can accept web widths of 2” to 24” with spindle diameters of 10”.

Domestic Price: Please Contact For Pricing

Call us at 775-883-1336 or email us at sales@plasmaetch.com for more information.

 

Overview

Built as an extension of our MK-II platform, it offers you the same repeatability, reliability and long life, as well as low maintenance costs. The Reactive Ion Etch (RIE) electrode offers the highest directional plasma effect.

Etching with our roll to roll plasma etcher in the large all aluminum chambers accommodate a generously sized active processing surface located between the feed and take up spools.

Features

Our standard vacuum pump is especially prepared for oxygen service. It is fully equipped with an N2 purge system, preventing any corrosive end products forming in the pump thus extending the service life and reducing the maintenance cycle. Processing your spooled product, whether they be small or large, PTFE, polyamide or Rigid-Flex Circuits, you will find that all are evenly etched and cleaned by the PE-2000R, ready for the next step in production.

Our simple to use, intuitive touch screen interface has control over every aspect of the plasma etching process ensuring reliability and repeatability.

The PE-2000R reel to reel plasma system is generally used to plasma treat rolls of material. The transport comes complete with a braking system, tensioning controls and speed controls. A dual computer operating system keeps track of plasma parameters and operations while the other maintains transport parameters. The system footprint will vary according to transport configuration.

Specifications

Standard System Features
Electrode Levels Horizontal Directional RIE (Reactive Ion Etch)
Electrode Configuration 72” Horizontal Planar
R.F. Generator & Matching Network 3000 Watts
Patented Process Temperature Control 1250 F to 3000 F
Mass Flow Controller, 2 Channels 0-2000 CC/Min
Low Gas Alarms Up to 4 Channels
Vacuum Gauge 0-10 Torr
Microprocessor System Touch Screen Control/Multiple Sequence Storage
Vacuum Pump, Oxygen Service 59 CFM
Vacuum Pump Booster Blower 355 CFM
Oil Filtration, Vacuum Pump 3 Microns
Automatic N2 Purging, Vacuum Pump
Controlled Rate N2 Chamber Purging Controlled Rate N2 Chamber Purging
Oil Mist Eliminator
Process Sequence Dual

Transport Features
Open Loop Tension Control Drive Motor with Particle Clutch
Closed Loop Speed Control Ferrofluidic Vacuum Feed Through
Footage Count, Line Speed, Tension Set Point Manual or Automatic with Jog/Speed Control

System Electrical & Mechanical
AC Service, 120 or 208 VAC, 50/60 Hz 50 Amps
System Weight (Plasma Console/Vacuum Pump) 2000/150 lbs.
Footprint, Plasma Console 120 “ X 45” X 79”
Footprint, Vacuum Pump 16 “ X 30” X 17”

Facility Requirements
AC Service, 120/208 VAC, 50/60 Hz, 3 Phase, 5 Wire 100 Amps
Compressed Air Service 80-100 PSI <0.5 CFM
System Environment Air Conditioned 850 F Maximum
Regulated Process Gases 25-30 PSI
Closed Loop Chilled Water Source

Options

Optional System Features
Computer Control System w/ Touch Screen Data Reporting, Event Viewing, Printer
Signal Light Tower
Dry Vacuum Pump 79/355 CFM
Throttle Vacuum Controller
Mass Flow Controllers Up to 4 Channels
Custom Chambers and Electrodes Per Customer Specifications

Optional Facility Equipment
Chilled Water Recirculation Closed Loop
Fume Scrubber Packed Bed
Compressed Air Dryer (Purge Gas Generator)

Typical System Users

Printed Circuit Board Manufacturers

Flex Circuit Manufacturers

Flexible Product Manufacturers

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plasma system 3522 Arrowhead Drive Carson City, NV 89706
Tel: 775-883-1336 Fax: 775-883-2559
Email: sales@plasmaetch.com