Plasma Cleaning Basics

Plasma Etching

Plasma can be defined as an ionized gas of positively and negatively charged particles. The properties of plasma are similar to both gas and liquid. Commonly used gases include O2, N2, Ar, H2, and CF4. These five gasses used singularly or in combination are used in the majority of the labs around the world for activation, etching and modification of surface chemistry.

 

 

 

Plasma Cleaning Removes Organics

Plasma vs. Wet

Plasma
Processes are easily controllable through rf power, pressure, time and gas selection.

No residues remain

Minimal amount of raw materials consumed

Waste products are mostly gaseous and are liberated directly into the atmosphere

Most gases used are not toxic, although some can be hazardous

Footprint is small

Operator training is minimal

Wet
Processes are sensitive to time and chemical concentrations

Must remove or neutralize residue requiring multiple washing steps

Large amounts of raw (liquid) materials required

High volumes of liquid waste to dispose of. Expensive gov’t permits required

Most solvents or acids used are toxic or hazardous

Requires a large amount of floor space

For safety sake, extensive training is mandatory