TT-1 | Turn Table Plasma Etcher
Industrial Surface Modification System

Overview

Based on our popular BT-1, it shares the same robust and reliable characteristics while providing yet another example of Plasma Etch surface modification innovation. The large all aluminum chamber accommodates a generously sized circular, rotating active processing surface has the option of insulated or direct on electrode method of treatment.

The TT-1 is deigned for effective processing of both, perforated and non-perforated magazines. Loading & processing prove to be quick and effective, keeping production rates high, easily meeting demands of even the heaviest requirements. The vacuum chamber contains two levels of electrodes, measuring up to 24" in diameter. The operator simply places the full magazines onto the electrodes and the turntables rotate at a constant speed during the plasma cycle.

Features

Its industrial powder coated frame has a easy to clean design with an eye to guarding your processing environment from contamination and with its compact footprint takes up so very little space for the work it accomplishes compared to our competitors Plasma Cleaners.

You will find in the processing of our lead frames, that uniformity is the key. Benefits to you are better pull and shear yielding less labor, less rejected parts and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with chemical methods.

Our simple to use, intuitive touch screen interface has control over every aspect of the plasma cleaning process ensuring reliability and repeatability.

In testing, the contact angle measurements proved to be higher in perforated magazine processing and have a slight reduction in non-perforated magazine processing. Overall results proved to be excellent and consistent.

Specification

Standard System Features
Single Level 17” Diameter Rotating Electrode
Electrode Control Electronic Jog and Speed Control
R.F. Generator & Matching Network 600 Watts
Mass Flow Controller, 2 Channels 0-500 CC/Min
Vacuum Gauge 0-10 Torr
Microprocessor System Touch Screen Control/Multiple Sequence Storage
Vacuum Pump/Booster Blower, Oxygen Service 29/355
Dual Process Sequence
Oil Filtration, Vacuum Pump 3 Microns
Oil Mist Eliminator

Optional System Features
RF Generator 1250 Watts
Automatic N2 Purging, Vacuum Pump
Low Gas Alarms Up to 4 Channels
Computer Control System w/ Touch Screen Data Reporting, Event Viewing, Printer
Signal Light Tower
Dry Vacuum Pump 79/355 CFM
Throttle Vacuum Controller
Mass Flow Controllers Up to 4 Channels
Controlled Rate N2 Chamber Purging
Oil Mist Eliminator
Custom Chambers and Electrodes Per Customer Specifications

System Electrical & Mechanical
AC Service, 120 or 208 VAC, 50/60 Hz 50 Amps
System Weight (Plasma Console/Vacuum Pump) 1200/150 lbs.
Footprint, Plasma Console 31 “ X 30” X 70”
Footprint, Vacuum Pump 16 “ X 30” X 17”

Facility Requirements
50 50 Amps
Compressed Air Service 80-100 PSI <0.5 CFM
System Environment Air Conditioned 850 F Maximum
Regulated Process Gases 25-30 PSI

Optional Facility Equipment
Chilled Water Recirculation Closed Loop
Fume Scrubber Packed Bed
Compressed Air Dryer (Purge Gas Generator)