Plasma Etch Technological Advantages
High Capacity Vacuum System
GENERAL
System designs must support high gas flow rates at low operating pressures to meet the requirements of the desmear/etchback process.
DESCRIPTION
Plasma Etch Desmear/Etchback Systems utilize a two stage vacuum system consisting of a backing pump in combination with a blower.
ADVANTAGES
• High gas flow rates and low chamber pressure result in faster process times and optimum etchback characteristics.
• Process uniformity and processing throughput are enhanced.
