Electronics - PCB Microvia Case Study
Industry: Electronics
Contaminates: N/A
Substrate: Printed Circuit Boards - Via Drilling
Equipment Used: Plasma Etch System, Model MK-III
Details of Application:
This company is a leading manufacturer of PCB's and now utilizes plasma technology to form micro-via holes in their circuit boards with virtually no undercut.
The plasma used is directional, referred to as Reactive Ion Etch (RIE).
This particular company uses a print and etch process to open the copper, the Reactive Ion Etch forms microvias.
Plasma Etch, Inc. is the first manufacturer to develop Reactive Ion Etch and uses plasma technology for micro-via formation. This project was done in cooperation with Continental Circuits of Arizona.