MK-II Plasma Etching System
The MK-II plasma etching system offers technological advantages such as the unique combination of process temperature control and electrostatic shielding. Both work in harmony to produce the most consistent, most uniform, and most reliable etch rates obtainable across an entire board's surface.
The MK-II is an excellent choice for use in industrial clean room settings as a plasma etching system.
Our patented gasless technology, originally developed for larger systems, is available on the Mark II and allows unmatched speed and uniformity.
The gasless Mark II is able to perform desmear and etch back without the added expense and environmental impact of CF4 gas. The system uses only electricity and oxygen.
Not only can you etch and desmear without CF4 gas, but customers have reported the gasless Mark II etching faster and more uniformly than a standard Mark II running CF4.
To purchase a MK-II, please contact us at (775) 883-1336 or email us at firstname.lastname@example.org.
Standard FeaturesElectrode Configuration
Default 24"Wx18"D (Several Optional Configurations) 6, 8, 12, 16 and 24-Shelf Systems AvailableGenerator
1250W to 5000W - 13.56MHz Continuously Variable Power Supply with Automatic Matching NetworkGas Control
Two 0-2000cc Mass Flow Controllers with Low Gas Source AlarmControl System
Color PLC-Based Touch Screen Control Interface; Stores Multiple Three-Step RecipesVacuum Gauge
1-2000 mTVacuum Pump
29CFM - 56CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)
- with -
Two Point Vacuum Pump Purge System
3 Micron Oil Filtration System
Oil Mist Eliminator
- or -
56CFM Dry Pump
355CFM or 845CFM Blower Booster
6061-T6 AluminumUnit Dimensions
Temperature Control SystemMade in the U.S.A.
Most systems can be customized with a wide range of options including:Custom Sized Vacuum Chamber, Number/Size of Electrodes
To ensure your system is able to specifically meet your throughput requirementsReactive Ion Etching Electrodes
Enables reactive ion etchingKHz/MHz Power Supplies with Automatic Matching Network
Higher watt or different frequency power suppliesPC-based Control System
For fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.Electrostatic Shielding
Greatly increases process uniformity across each shelf by eliminating excess etching at the outer bounds of the processed materialTemperature Control System
To maintain specific temperatures in the processing chamber for enhanced uniformity between shelves and application-specific needsDry and Oil-Driven Vacuum Pumps and Blower Boosters
A variety of vacuum pump options for more control over the process chamber pressureChiller System for Dry Vacuum Pump
Necessary for the operation of a dry vacuum pumpChamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator
To ensure thorough removal of contaminants from the etching system, providing uniformity and increasing longevityVacuum Pump Oil Mist Eliminator
Captures oil from vacuum pump exhaustVacuum Pump Oil Filtration
Filters the vacuum pump oil down to a 3 micron level which increases the longevity of the oil and the vacuum pumpAutomatic Vacuum Control
Provides automation of the process chamber pressureAdditional Digital Mass Flow Controllers
Provides digital automation and monitoring of process gasesSoftware Configurable Gas Steering Matrix
Designed to allow for up to 5 process gas inputs; up to 3 are selectable at any time by software driven controlsLow Gas-Source Alarm
Notification for when your process gas container needs replenishedLight Tower
For easy visualization of the steps of the plasma processing sequenceFume Scrubber
To eliminate hazardous fumes/contaminants from the chamber/vacuum pump exhaust of the etching system
120/208 VAC, 50/60 Hz @ 50-100Amps, 3 Phase, 5 WireCompressed Air Service
80-100PSI, 0.5CFMRegulated Process Gases
Cooling Water Source for RF Generator @ 2GPM