Electronics - PCB Multilayer Case Study
Industry: Electronics
Contaminates: Hydrocarbons
Substrate: Printed Circuit Boards (Multilayer - Teflon)
Equipment Used: Plasma Etch System, Model MK-II-3
Details of Application:
This company is a manufacturer of Teflon multi-layer PCB's They now use isotropic plasma to activate the Teflon surface in the drilled hole prior to electroless copper plating.
This company utilizes a dual sequence plasma for the surface activation process. The first is a Tetra Fluoro-methane-oxygen plasma for 40 minutes, followed by a 20 minute nitrogen plasma. This process has produced the greatest decrease in contact angle measurements.
Plasma Etch, Inc. was chosen due to the excellent contact angle reductions experienced by the PCB manufacturer.