Plasma Cleaner | PE-50 Benchtop
Low Cost Plasma Cleaning System

The Plasma Etch, Inc. PE-50 is one of our lowest priced plasma cleaners, though it offers many features not found in competitive units. This plasma cleaner is made for smaller production facilities, research and development labs, testing facilities, universities and is great for plasma sterilization and surface modification.
*Shown with Optional System Features
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Overview
This system is made for smaller production facilities, R&D facilities and universities. The system features an implosion proof 6” w x 7.5” d x 4” h Rectangular welded Aluminum Vacuum Chamber and a direct powered RF electrode.
Plasma cleaning applications include medical devices, solar cells, printed circuit boards, connectors, MEMs, nanotechnology, wafer level packaging, contact lenses as well as many other related semiconductor processes.
Features
As in all Plasma Etch cleaning systems a capacitive parallel plate design is used for the most effective plasma generation.
Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around the exterior of the chamber.
This is an inefficient method resulting in loss of power input and considerably lower etch/clean removal rates.
The PE-50 plasma cleaner is comprised of components made in the USA and is built in and supported from our Carson City, NV headquarters with the best customer service available in the industry.
The utility and flexibility of plasma cleaning systems from the fact that plasma can be used to modify a variety of surfaces under precisely controlled conditions, without the safety hazards and liquid waste associated with wet cleaning and etching. If effective surface treatment is critical to the efficiency of a process or the reliability of a product, plasma technology may provide the answer.
The PE - 50 plasma cleaner is being used to remove organic and inorganic contamination, increase wettability, increase bond strength, and remove residue. The process is effective on a variety of materials used in an even greater variety of products.
Specifications
Standard System Features
Welded Aluminum Vacuum Chamber, 6” X 7.5” X 4”
Single 4.5” x 6” horizontal Electrode
150 Watts @ 50 kHz R.F. Generator
Precision Needle Valve Flow Control 0-25 CC/Min
Pirani Vacuum Gauge 0-1 Torr
5 CFM Oxygen Service Vacuum Pump
Single Process Sequence
Optional System Features
100W @ 13.56MHz RF Generator and automatic Matching network
Light Bar
Mass Flow Meter
8" x 8" x 4" Chamber
7" x 7" Electrode
System Electrical & Mechanical
AC Service, 120VAC 60 Hz @ 15 A or 220 VAC 50 Hz @ 14A
Console Shipping Weight 55lbs
Vacuum pump shipping weight 35lbs
Console Footprint 14 “ X 14” X 18”
Pump footprint 7” x 16” (sits on the LH side of the console)






















