BT-1 | Plasma Cleaning System
Industrial Plasma System

The BT-I plasma surface treatment system is one of our most popular and versatile plasma cleaning, plasma etching, and RIE (Reactive Ion Etching) systems. It presently is in operation throughout the world in a multitude of different markets. For example, it is found being used extensively in the medical, semiconductor, electronics, PCB (printed circuit board), industrial manufacturing, and solar markets. It is a true plasma surface treatment masterpiece.
The BT-1 is available in two unique processing configurations:
1) Regular Plasma Cleaner or Plasma Etcher plasma processing mode2) RIE - Reactive Ion Etch plasma processing mode
Domestic Price: Please Contact For Pricing
Call us at 775-883-1336 or email us at sales@plasmaetch.com for more information.
Overview
Benefits to you are better adhesion or marking, cleaner parts with less labor and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with cleaning and priming. The large all aluminum chamber accommodates a generously sized active plasma cleaning surface, our standard configuration of five levels of processing shelves provides you with 2100 square inches of useable plasma processing area.
The BT-1 comes standard with Touch Screen Controls, which makes processing extremely easy and since your recipes or parameters are stored for future use it's easy to keep production up and running at a standard. User-friendly custom software and programming, the BT-1 is extremely easy to operate. Plasma Etch, Inc. will manufacture the electrodes in a custom configuration to suit the size and spacing of your product at no extra charge.
Features
Our intuitive and simple to use touch screen interface has control over every aspect of the plasma cleaning process ensuring reliability and repeatability.
The console’s compact footprint takes up very little space for the work it accomplishes and the system is supplied with a vacuum pump especially prepared for oxygen service. The vacuum pump is available with a two point N2 purge system to mitigate the formation of corrosive end products in the pump thus extending the service life and reducing the maintenance cycle of systems using Halogenated gasses.
We can custom configure a systems chamber and electrode to suit your requirement; RIE (Reactive Ion Etch); Semiconductor Lead Frame magazines and rotating horizontal and vertical electrodes.
Specification
Standard System Features
Welded aluminum chamber measuring 25”w, 25”d and 21”h
5 Horizontal processing electrodes; 20” x 21” on 3” spacing
600 Watts R.F. Generator@ 13.56 MHz; Automatic matching network
One 500 SCCM Mass Flow Controller
Pirani Vacuum Gauge 0-1 Torr
Microprocessor System w/ Touch Screen interface
Stores up to 20 two step recipes
29 CFM Oxygen Service Vacuum Pump w/ 3 Micron Oil Filtration
Optional System Features
Electrostatic Shielding
Process Temperature Control
1250 Watt RF Generator @13.56MHz
59 CFM Oxygen Service Vacuum Pump
355 CFM Vacuum Booster Blower
RIE (reactive ion electrode) configurations
Low Supply pressure Gas Alarms
Microsoft Computer Control System w/ Touch Screen Interface
Intuitive plasma etch operating software w/Data Reporting, Event monitoring, Printing
Signal Light Tower | Active Vacuum Controller | 4 Mass Flow Controllers
Automatic 2 point N2 Vacuum Pump Purge | Controlled Rate N2 Chamber Purge
Vacuum pump exhaust Oil Mist coalescing filter
Custom Chambers and Electrodes for your requirement
Facility Optional
Closed Loop chiller for RF generator
Packed Bed Fume Scrubber
Compressed Air Dryer (Purge Gas Generator)
System Specifications
System Weight Console1200lbs. Vacuum Pump150lbs.
Footprint, Plasma Console 70“ X 36” X 32”
Footprint, Vacuum Pump 16“ X 30” X 17”
Facility Requirements
AC Service, 120/208 VAC, 50/60 Hz, 3 Phase, 5 Wire, 30 Amps
Compressed Air Service 80-100 PSI, 0.5 CFM
System Environment Air Conditioned 85 F Non-condensing
Regulated Process Gases 15 PSI
Case Study
Details of Application:
This company is a leading supplier of illuminated switches to the Aerospace Industry.
They bond NVG glass with an acrylic and fiber optic plate. They use an RTV (Room Temperature Vulcanizing) epoxy to bond the materials together to produce illuminated push button switches.
The acrylic substrate is processed to activate the surface. This plasma cleaning on the acrylic increases it's ability to bond with the fiber optic plate.
Studies have shown that plasma subsequent to bonding will increase the lifetime reliability of the bond. This company chose Plasma Etch, inc. because we offered the most inform etch, along with the shortest cycle time.
This company uses an oxygen plasma to activate the acrylic surface to increase bond strength.


















