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PE-200 | Plasma Etching Benchtop System
Industrial Plasma System
The PE-200 is our industrial strength bench top plasma etching system and supplied with an oxygen service vacuum pump. This robust, reliable and yet quite affordable system was developed for the busy 24/7 manufacturing firm that cannot have downtime.
The PE-200 is available in three unique configurations:
1) Regular Plasma Cleaning and Plasma Etching
2) Reactive Ion Etch (RIE)
3) PE-200 convertible configuration, which includes both anisotropic and isotropic plasma processing in a single system. Removable tray configuration.
Price: Please contact for pricing
Overview
Our welded aluminum vacuum chamber encloses a generous 500 square inches of active plasma processing surface. Surface modification with Plasma Etch yields increased bond strength and cleanliness of most any surface material.
Often purchased by small production facilities, research and development labs, testing facilities and universities. Industry users include Biomedical, Dental, Electronics, Light Industrial, Medical, Plastics, Optical, Edge Isolation Etch for Solar Cell, and Solar Panel to name a few.
Features
Etching our plasma cleaner rather than with chemical baths can eliminate expensive hazardous chemical waste. Our simple to use, intuitive touch screen interface controls every aspect of the plasma process ensuring repeatability.
We will custom configure the chamber and electrode configuration to suit your product or process including custom sized horizontal electrodes, RIE (Reactive Ion Etch) and Semiconductor Lead Frame magazines. Rest assured that Plasma Etch will be there for you as long as you own your system.
Specification
Standard System Features
Welded Aluminum Vacuum Chamber
3 Horizontal processing Electrode Levels; 13” wide x 16” deep on 3” spacing
300 Watt R.F. Generator @ 13.56 MHz | Automatic Matching Network
One 200 SCCM Mass Flow Controller | Pirani Vacuum Gauge 0-1 Torr
Microprocessor Control System w/Touch Screen interface
Stores up to 20 two step recipes | 29 CFM Oxygen Service Vacuum Pump
3 Microns Vacuum Pump Oil Filtration
Optional System Features
Electrostatic Shielding | Process Temperature Control
600 W RF Generator @ 13.56MHz | 600W Automatic Matching Network
59 CFM Vacuum oxygen service vacuum pump (3 phase)
Automatic 2 point N2 purge system for vacuum pump longevity
Signal Light Tower | MKS Automatic Throttle Vacuum Controller
2 additional Mass Flow Controllers (total of 3)
Software selectable 5 process gas input steering matrix
Controlled Rate N2 Chamber Purge
Oil Mist Coalescing Filter on Vacuum pump exhaust
Custom Chamber size and configuration
Custom Electrode Size and configuration
RIE (reactive ion electrode) configuration
Facility Optional
Packed Bed Fume Scrubber
Compressed Air Dryer for vacuum pump Purge Gas supply
System Specifications
AC Service 208 VAC, 50/60 Hz 30 Amps; single or three phase
System Weight (Plasma Console/Vacuum Pump) 350/180 lbs.
Footprint, Plasma Console 36 “ X 36” X 32”
Footprint, Vacuum Pump 16 “ X 32” X 20”
Facility Requirements
AC Service 120/208 Five wire 3 Phase or 208 four wire single phase
Conditioned Environment at less than 850 F non-condensing
Compressed Air Service 80-100 PSI <0.5 CFM
Regulated Process Gases 15-30 PSI
Case Study
Details of Application:
This company manufactures various ceramic parts. To gauge the success of plasma treatment to these ceramics parts, a before and after treatment contact angle was taken. Before treatment, contact angle was 88 degrees. After treatment, the contact angle was reduced 12 degrees. The contact angle in this instance was measured in 5 different places on each substrate and the contact angle remained ± 2 degrees.
Subsequent studies have correlated a reduction in contact angle results and dramatically increased bond strength.
This company uses an argon-oxygen plasma treatment prior to wire bonding to increase adhesive and bond strength.
This company chose Plasma Etch, Inc. due to the uniform etch that was received on their test samples.
