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Magna Plasma Desmear and EtchBack System

The Magna is the world’s first plasma etching system that eliminates the need for CF₄ gases used by PCB manufacturers for plasma processing. The Magna sets new standards in several key areas, including faster etch times, lower power usage, and incredible process uniformity not achievable with any other system.

The Magna provides precise, uniform etching simultaneously on both sides of processed materials. The high performance, low operating costs, and environmentally-friendly usage makes the Magna a significant breakthrough in plasma etching technology.

Desmear Capabilities

When circuit boards are manufactured, layers of copper are often sandwiched between layers of polyimide or epoxy (FR4). When these circuit boards are drilled for wire bonding or IC chip installation, the polyimide or epoxy will smear on the copper which can interfere with the electrical connection.

The Magna PCB etching system was designed to remove these contaminants as well as thoroughly clean the copper to allow reliable electrical connections. A clean and smear-free hole is essential to reliably solder wire, IC chips, or other conductive material to the hole.

Plasma etchback not only cleans the residue left behind on the copper by the polyimide or FR4 epoxy by the drilling process, but it also etches away at the polyimide or epoxy material. This allows a multi-surface bonding to the solder or other conductive material.

The material in between layers of copper is etched away by the plasma, allowing solder to contact more of the copper and create a stronger and electrically less resistant connection. Etchback is often used in high grade and military applications.

The process is significantly more accurate than traditional wet chemical cleaning methods. Our plasma products prevent the use of environmentally hazardous waste chemicals and creates no hazardous waste products. This is safer for not only our environment but for lab staff as well.