PE-100 Benchtop Plasma System
The PE-100 is a complete plasma treatment solution capable of reactive ion etching, plasma functionalization, and more. This model is perfect for manufacturers, medical facilities, universities, research facilities, or any other company in need of a cost-effective, production-grade plasma processing solution.
The convenient chamber size, along with the availability of high frequency RF power, combine to create a production capable unit small enough to fit nearly anywhere in your lab or production work space.
Full laptop control enables enhanced consistency and complexity of recipes. PC automation also provides ease of use on the production floor.
This model is available in one of three standard configurations:
1) Plasma Cleaning/Plasma Etching
2) Reactive Ion Etching (RIE)
3) Convertible Configuration - Includes both isotropic and anisotropic plasma processing in a single system. Removable tray configuration.
To purchase a PE-100, please contact us at (775) 883-1336 or email us at email@example.com.
Standard FeaturesElectrode Configuration
Three Stacked Horizontal (9"Wx13"D + 3" Clearance) (Several optional configurations available)Generator
300W 100KHz Continuously Variable Power SupplyControl System
A laptop loaded with Plasma Etch, Inc. software is included for fully automatic system operation, process sequencing, multiple recipe storage, and other advanced featuresGas Control
One 0-50cc Mass Flow ControllerVacuum Gauge
1-2000 mTVacuum Pump
8CFM 2-Stage Direct Drive Oil Pump with Oil Mist Coalescing Filter (Oxygen Service – Krytox Charged)Chamber Material
6061-T6 AluminumChamber Dimensions
160lbsVacuum Pump Weight
68lbsMade in the U.S.A.
Most systems can be customized with a wide range of options including:Custom Sized Vacuum Chamber, Number/Size of Electrodes
To ensure your system is able to specifically meet your throughput requirementsReactive Ion Electrodes
Enables reactive ion etchingMHz Power Supplies with Automatic Matching Network
Higher watt/frequency power suppliesPC-based Control System
For fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.Electrostatic Shielding
Significantly increases process uniformity by eliminating excess etching at the outer bounds of the processed materialTemperature Control System
To maintain specific temperatures in the processing chamber for enhanced uniformity and application-specific needsDry Vacuum Pump
For more control over the process chamber pressureChamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator
To ensure thorough removal of contaminants from operating equipment, providing uniformity and increasing longevityVacuum Pump Oil Mist Eliminator
Captures oil from vacuum pump exhaustVacuum Pump Oil Filtration
Filters the vacuum pump oil down to a 3 micron level, increasing the longevity of the oil and the vacuum pumpAutomatic Vacuum Control
Provides automation of the process chamber pressureAdditional Digital Mass Flow Controllers
Provides digital automation and monitoring of process gasesSoftware Configurable Gas Steering Matrix
Designed to allow for up to 5 process gas inputs with 3 selectable at any timeLow Gas-Source Alarm
Notification for when your process gas container needs replenishedLight Tower
For easy visualization of the steps of the plasma processing sequenceFume Scrubber
To eliminate hazardous fumes/contaminants from the chamber/vacuum pump exhaust
120VAC / 60Hz @ 15A or 220VAC / 50Hz @ 14ACompressed Air Service
80-100PSI, 0.5CFMRegulated Process Gases
15PSI, 2-Stage Regulator