PE-75 Plasma Asher
The PE-75 is our most popular system for use as a plasma asher. Although all of our systems are versatile and can perform many tasks without changing configuration settings, the PE-75 is the best value in the industry for plasma ashing semiconductor wafers.
Plasma ashing is the process of removing photoresist from an etched wafer. Ashing is performed with fluorine or oxygen and is almost always used with a single gas plasma. The versatile PE-75 comes with two gases installed for other cleaning and ashing purposes.
The PE-75 is our largest entry level plasma treatment system. It's a feature packed, low cost, and robust machine that is perfect for production facilities, research labs, universities, medical facilities, or any industry which needs a small-scale, cost-effective plasma ashing solution. It has all the features of the PE-50 XL but also features a larger chamber size for larger processing applications.
This unit excels at plasma cleaning and surface modification as well as use as a plasma asher.
The PE-75 may also be used in preparing asbestos specimens as a low temperature plasma treatment.
If you are looking for a fully automated solution, our PE-75 Venus plasma asher combines the high value of the PE-75 with fully automated processing. The Venus includes the same laptop control found on our larger systems.
To purchase a PE-75, please contact us at (775) 883-1336 or email us at firstname.lastname@example.org.
Standard FeaturesElectrode Configuration
One Horizontal (9"Wx10"D + 5.5" Clearance)Generator
400W 50KHz Continuously Variable Power SupplyGas Control
Two 0-25cc/min Rotometers with Precision Needle ValvesControl System
PLC-Based Keypad Input System with Alphanumeric Display; Stores One Recipe for Automatic Process SequencingVacuum Gauge
1-2000 mTVacuum Pump
5CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)Chamber Material
6061-T6 AluminumChamber Dimensions
10.75” Deep x 10” RoundUnit Dimensions
90lbsVacuum Pump Weight
35lbsMade in the U.S.A.
Note: High frequency units may have larger external dimensions, so check with your sales rep if your space is limited.
Optional FeaturesTemperature Control System
To maintain specific temperatures in the processing chamber for enhanced uniformity and application-specific needsMHz Power Supplies with Automatic Matching Network
Higher watt/frequency power suppliesPC-based Control System
For fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.Dry Vacuum Pump
For more control over the process chamber pressureChamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator
To ensure thorough removal of contaminants from operating equipment, providing uniformity and increasing longevityAdditional Gas Inputs/Rotometers
Allows for more complex process gas combinationsDigital Mass Flow Controllers
Provides digital automation and monitoring of process gasesLight Tower
For easy visualization of the steps of the plasma processing sequence
120VAC / 60Hz @ 15A or 220VAC / 50Hz @ 14A