PE-75 Plasma Asher

PE-75 Plasma Asher

The PE-75 is our most popular system for use as a plasma asher. Although all of our systems are versatile and can perform many tasks without changing configuration settings, the PE-75 is the best value in the industry for plasma ashing semiconductor wafers.

Plasma ashing is the process of removing photoresist from an etched wafer. Ashing is performed with fluorine or oxygen and is almost always used with a single gas plasma. The versatile PE-75 comes with two gases installed for other cleaning and ashing purposes.

The PE-75 is our largest entry level plasma treatment system. It's a feature packed, low cost, and robust machine that is perfect for production facilities, research labs, universities, medical facilities, or any industry which needs a small-scale, cost-effective plasma ashing solution. It has all the features of the PE-50 XL but also features a larger chamber size for larger processing applications.

This unit excels at plasma cleaning and surface modification as well as use as a plasma asher.

The PE-75 may also be used in preparing asbestos specimens as a low temperature plasma treatment.

If you are looking for a fully automated solution, our PE-75 Venus plasma asher combines the high value of the PE-75 with fully automated processing. The Venus includes the same laptop control found on our larger systems.

To purchase a PE-75, please contact us at (775) 883-1336 or email us at The PE-75 is also available to rent on a month-to-month basis. Three month minimum required. Pricing starts at $840/month.

Standard Features

Electrode Configuration

One Horizontal (9"Wx10"D + 5.5" Clearance)


400W 50KHz Continuously Variable Power Supply

Gas Control

Two 0-25cc/min Rotometers with Precision Needle Valves

Control System

PLC-Based Keypad Input System with Alphanumeric Display; Stores One Recipe for Automatic Process Sequencing

Vacuum Gauge

1-2000 mT

Vacuum Pump

5CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)

Chamber Material

6061-T6 Aluminum

Chamber Dimensions

10.75” Deep x 10” Round

Unit Dimensions


Unit Weight


Vacuum Pump Weight


Made in the U.S.A.

Note: High frequency units may have larger external dimensions, so check with your sales rep if your space is limited.

Optional Features

Temperature Control System

To maintain specific temperatures in the processing chamber for enhanced uniformity and application-specific needs

MHz Power Supplies with Automatic Matching Network

Higher watt/frequency power supplies

PC-based Control System

For fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.

Dry Vacuum Pump

For more control over the process chamber pressure

Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator

To ensure thorough removal of contaminants from operating equipment, providing uniformity and increasing longevity

Additional Gas Inputs/Rotometers

Allows for more complex process gas combinations

Digital Mass Flow Controllers

Provides digital automation and monitoring of process gases

Light Tower

For easy visualization of the steps of the plasma processing sequence

Facility Requirements


120VAC / 60Hz @ 15A or 220VAC / 50Hz @ 14A