PE-75 Plasma Asher

PE-75 Plasma Asher

The PE-75 is our most popular system for use as a plasma asher. Although all of our systems are versatile and can perform many tasks without changing configuration settings, the PE-75 is the best value in the industry for plasma ashing semiconductor wafers.


Plasma ashing is the process of removing photoresist from an etched wafer. Ashing is performed with fluorine or oxygen and is almost always used with a single gas plasma. The versatile PE-75 comes with two gases installed for other cleaning and ashing purposes.


The PE-75 is an entry level plasma treatment system. It's a feature packed, low cost, and robust machine that is perfect for production facilities, research labs, universities, medical facilities, or any industry which needs a small-scale, cost-effective plasma ashing solution. It has all the features of the PE-50 XL but also features a larger chamber size for larger processing applications.


This unit excels at plasma cleaning and surface modification as well as use as a plasma asher.


The PE-75 may also be used in preparing asbestos specimens as a low temperature plasma treatment.


If you are looking for a fully automated solution, our PE-75 Venus plasma asher combines the high value of the PE-75 with fully automated processing. The Venus includes the same laptop control found on our larger systems.

To purchase a PE-75, please contact us at (775) 883-1336 or email us at sales@plasmaetch.com.


Standard Features

Electrode Configuration

One or Two Horizontal (9"Wx10"D)

Generator

400W 50KHz Continuously Variable Power Supply

Gas Control

Two 0-25cc/min Rotometers with Precision Needle Valves

Control System

PLC-Based Keypad Input System with Alphanumeric Display; Stores One Recipe for Automatic Process Sequencing

Vacuum Gauge

1-2000 mT

Vacuum Pump

5CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)

Chamber Material

6061-T6 Aluminum

Chamber Dimensions

10.75” Deep x 10” Round

Unit Dimensions

18"x19"x24"

Unit Weight

90lbs

Vacuum Pump Weight

35lbs

Made in the U.S.A.

Note: High frequency units may have larger external dimensions, so check with your sales rep if your space is limited.

Optional Features

Temperature Control System

To maintain specific temperatures in the processing chamber for enhanced uniformity and application-specific needs

MHz Power Supplies with Automatic Matching Network

Higher watt/frequency power supplies

PC-based Control System

For fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.

Dry Vacuum Pump

For more control over the process chamber pressure

Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator

To ensure thorough removal of contaminants from operating equipment, providing uniformity and increasing longevity

Additional Gas Inputs/Rotometers

Allows for more complex process gas combinations

Digital Mass Flow Controllers

Provides digital automation and monitoring of process gases

Light Tower

For easy visualization of the steps of the plasma processing sequence

Facility Requirements

Electrical

120VAC / 60Hz @ 15A or 220VAC / 50Hz @ 14A


See just how easy our industry leading PE-75 is to use by watching this plasma demonstration.

Contact Us

Phone: 775-883-1336
Fax: 775-883-2559
E-mail: sales@plasmaetch.com

Office Hours: Weekdays 7:30 AM - 4:30 PM PST

Address: 3522 Arrowhead Drive
Carson City, Nevada, 89706 USA

Download PDF

PE-75 Flyer
PE-75 Plasma System

Similar Systems

PE-25
PE-25
PE-50
PE-50
PE-50 XL
PE-50 XL

What is Plasma Ashing?

Plasma Ashing consists of etching photoresist, usually from an etched wafer, and often in the semiconductor industry. A photoresist or etching mask is put on the treated surface to map out the pattern. This photoresist is later removed with plamsa for further processing.

We don't want to remove any other part of the surface. The goal is to leave behind just the desired pattern on the surface of the material. This removal is what we call plasma ashing. This step is an important part of manufacturing semiconductor wafers.

Treating a wafer requires using oxygen (O2) in the vacuum chamber. The oxygen ionizes and becomes oxygen plasma which can be used to plasma ash the photoresist. This assists in the removal of the etching mask.